July 10, 2011
When the air source heat pump unit is running, it is inevitable that operating failures will occur due to various factors. The following are some common failures.
1. Common switch failures
Common switch failure factors may be common failures of the air source heat pump electronic control system, such as damage to the internal contacts of the water flow switch, disconnection, short circuit or virtual connection of the water flow switch wiring, damage to the original components of the electronic control PCB detection circuit, electromagnetic interference of the electronic control system, etc.
2. Circulating water system failure
Failure of the air source heat pump water circulation system. Such as: there is really no water flow inside the pipeline, the circulating water flow inside the pipeline is too small, dirt or water alkali blocks the mechanical parts of the water flow switch, the heat exchanger is frozen, and the water flow switch is installed in the wrong direction.
3. High voltage failure
There are three factors that lead to common high voltage failures.
1) Possibility of common failures of the electronic control system
The high voltage switch itself is damaged, the high voltage switch wiring is disconnected, short circuited or virtual connection, the electronic control PCB detection circuit has original damage, and the electronic control system is electromagnetic interference.
2) Common failure possibilities of the refrigeration system
The air source heat pump refrigeration system is blocked, non-condensable gas is mixed in the refrigeration system, the refrigerant is overcharged, and non-azeotropic working fluid is charged in gas phase during maintenance (refrigerants starting with 4, such as R410A and R407, must be liquid when charged).
3) Common failure possibilities of the water circulation system
The cooling water flow inside the air source heat pump condenser is insufficient, the cooling water temperature inside the condenser is too high, and the dirt or water alkali attached to the inside of the condenser increases the thermal resistance of the heat transfer interface.
